MIL-DTL-15665J
chemical composition of the copper content of the copper base alloy shall
be as specified in Table I.
TABLE I.
Copper content of copper base alloys.
ALLOY
COPPER
Yellow Brass
64.0-68.5
Red Brass
84.0-86.0
Gilding Metal
94.0-96.0
Free Cutting
60.0-63.0
Brass
Bronze
89.0-91.0
Nickel Silver
63.0-65.5
1/, 2/
Low Brass
78.5-81.5
1/ Copper content for the nickel silver pin only may be 53.6 to 56.5%.
2/ When nickel silver is used as a base material, the nickel content shall
be not less than 18%.
3.4.2
Gold plating.
3.4.2.1
24 karat gold for plating.
Gold for plating shall be 24
karat.
3.4.2.2. 22 karat gold for plating. When specified on the
applicable specification sheet, gold for manufacturing insignia with
nickel underplating shall be 22 karat.
3.4.3 Zinc aluminum alloy. The alloy used for die casting shall
conform to alloy AG 40a or AC 41a of ASTM-B-86.
3.4.4. Nickel for plating. Nickel for plating shall be the nickel
plating normally used in commercial practice.
3.4.5 Silver for plating.
Silver for plating shall be not less than
99.5 percent pure silver.
Rhodium Plating. Rhodium for plating shall be the rhodium
3.4.6
plating normally used in commercial practice.
3.4.7
Solder.
3.4.7.1 Hard Solder. Hard solder shall be a silver alloy solder
having a melting point of not less than 1075 degrees Fahrenheit (561.7
degrees Celsius).
3.4.7.2 Soft Solder. Soft solder shall be a lead-tin alloy having a
melting point of not less than 375 degrees Fahrenheit (190.58 degrees
Celsius).
3.4.8
Enamel.
All enamel shall be lead free.
3.4.8.1 Hard enamel. Hard enamel shall be a glass, vitreous type
enamel fused with metallic oxides to produce the required color, opacity
or translucence and shade.
4
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